Blacked rolled single-sided adhesive substrate is a special material used for manufacturing flexible circuit boards (FPC) and rigid flex PCBs. To understand its advantages, we can analyze it one by one from its three key features - "blackening", "rolling", and "single-sided adhesive".
Superior heat dissipation: The black surface has stronger thermal radiation ability, which helps the circuit board to dissipate heat more effectively during operation. This is particularly important for electronic devices with slightly higher power, compact space, and difficult heat dissipation, which can improve the long-term reliability of the product.
Reduce signal interference and reflection:
Preventing Light Corrosion and Leakage: During the manufacturing process, when light is exposed on the circuit board, the brownish or pinkish traditional copper surface may reflect the light to areas that should not be exposed, causing deviations in the edges of the circuit (commonly known as "side corrosion"). The black surface can greatly absorb these stray light, resulting in clearer and more accurate circuit lines with clearer edges.
Improving the integrity of high-frequency signals: In high-frequency circuits, the "skin effect" of signal transmission is significant, and current will concentrate on the surface of the conductor. The bond between the blackened layer and copper is tighter, providing a smoother and more consistent transmission surface for high-frequency signals, reducing signal reflection and loss during transmission.
Improving appearance quality and consistency: Black gives the circuit board a unified, deep, and high-end appearance, meeting the aesthetic needs of many modern consumer electronics products such as cameras and smart wearables.
3、 The practical significance of the "single-sided adhesive" structure
Single sided adhesive "refers to the adhesive only attached to one side of the substrate (such as polyimide PI), while the other side is rolled copper foil.
Flexible structure, suitable for soft hard bonding plates: This structure is an ideal choice for manufacturing soft hard bonding plates. The adhesive side can be firmly bonded to the core material of the hard board (FR-4) through lamination, while the other side (copper side) is used for etching circuits and surface treatment. It acts as a 'bridge' between the flexible and rigid parts.
Balance between cost and performance: Compared to more expensive non adhesive (2L-FCCL) substrates, single-sided adhesive substrates provide better interlayer bonding and lower processing difficulty and cost while ensuring certain performance (especially lower bending resistance than non adhesive but far superior to adhesive FR4).
summary
Overall, the blackened rolled single-sided adhesive substrate integrates the advantages of multiple materials:
Blacking brings about "high-precision manufacturing, excellent heat dissipation, and appearance".
Rolled copper provides' special flexibility and bending resistance '.
The single-sided adhesive structure achieves "reliable lamination bonding and flexible soft hard connection".
