Halogen free yellow cover film (CVL) is the core protective material for flexible circuit boards (FPC). It is made of polyimide (PI) film as the substrate, coated with a halogen-free thermosetting epoxy resin adhesive layer, separated by release paper, and cured at high temperature. It has the advantages of halogen-free environmental protection, insulation and heat resistance, easy inspection, and bending resistance, and is widely used in the field of electronic manufacturing. It is a key material to ensure the stability and prolong the service life of FPC circuits.

In today's world where electronic devices are increasingly becoming thin, flexible, and high-density integrated, flexible circuit boards play an irreplaceable role. However, the high flexibility also brings specific challenges: parts that require installation of components, resistance to external mechanical forces, or precise assembly precisely require stability and robustness. The reinforcement board is a key component born to solve this contradiction. It is like giving a partial "skeleton" to flexible circuits, providing a solid backing where strength and support are needed, and is the behind the scenes contributor to ensuring product reliability and durability.

In today's electronic manufacturing industry, environmental protection, safety, and high performance have become irreversible trends. Halogen free double-sided adhesive substrate, as a key material derived from traditional FR-4 substrate, perfectly meets these needs and plays an indispensable role in many electronic fields.

Halogen-free and glue-free double-sided substrate is a high-performance core material for circuit boards. Due to its dual advantages of environmental friendliness (halogen-free) and high performance (glue-free), it is typically not used in ordinary, inexpensive electronic products but rather in applications requiring higher performance or reliability.